Santa Clara, Calif., and Tel Aviv, Israel, May 22, 2012—Cephasonics, Inc., a technology-innovation leader focused on delivering mixed-signal semiconductors, modules and subsystems to the imaging and ultrasound markets, today announced that it has signed a distribution agreement with Tritech Ltd. Tritech, a leading Israeli stocking representative and distributor, will be a key partner driving the success of Cephasonics’ embedded-ultrasound product offering in the highly dynamic, innovative Israeli medical imaging and device markets. Cephasonics will demonstrate its products, including conducting imaging demos of its CSK9130 complete 64-channel beamforming sub-system, in the Tritech booth at the New-Tech Exhibition 2012 held here in Tel Aviv from May 22-23, 2012.
"We are excited to partner with Tritech to make the exceptional performance and flexibility benefits of Cephasonics’ ultrasound front-end sub-system and components solutions more readily available to Israeli manufacturers of ultrasound-based equipment,” said Danny Kreindler, senior director of marketing at Cephasonics. "Thanks to Tritech, we’ve engaged with several Israeli companies developing cutting-edge ultrasound based-solutions. Tritech will provide excellent local support to these customers.”
Cephasonics released the CSK9130, its second-generation ultrasound beamforming front-end system, late last year. Designed with Cephasonics’ award-winning AutoFocus™ technology, the incorporated IC is the industry’s only merchant-available receive beamformer chip. The highly configurable, flexible sub-system and IC support a wide range of ultrasonic-based applications.
Cephasonics also sells its award-winning 16-channel, 12-bit, 65Msps analog-to-digital converter that offers the industry’s highest density and lowest power per channel.
"We’ve seen tremendous acceptance of Cephasonics’ ultrasound technology and solutions at our medical imaging and device accounts,” said Oriel Sallary, vice president of sales at Tritech Ltd. "Their technology, available in complete sub-system, module, and IC forms, coupled with our high-level technical and sales support, provides our customers with unparalleled complete solutions.”